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  • 表面颗粒及缺陷检测设备

    The Candela Instruments family of Optical Surface Analyzers was first developed for inspection of hard disk substr

  • 探针式台阶仪

    Bench Top Profilers: • D500 D600 • Designed for simple profiling needs • P-7 P-17 Profilers • Advanced

  • 样片厚度及翘曲检测设备

    None contact measurement : 1 TTV Bow Warpage Wafer Thickness 2 Surface profile 3 Film thickness 4 Film stress

  • 傅立叶变换红外光谱仪

    硅中杂质分析---硅中间隙氧和代位碳含量的检测外延层厚度的测定---外延层厚,采用干涉图差减方法---外延层薄,采用倒谱计算方法钝化层分析-

  • 光学轮廓仪

  • 原子力显微镜

    Over 33 years experience for AFM tools • Scan length: 50*50um or 100*100um • Z scanner: 15um, 30um • Profiler noise: < 0 02nm • Stage movement X-Y: 150*150mm or 200*200mm • Stage movement Z: 25mm Wafer size: 2” 3” 4” 6” 8?

  • 膜厚测试设备

    Thin-film thickness of samples up to 450 mm in diameter aremapped quickly and easily with the F50 advanced spectralreflectance system The motorized r-theta stage movesautomatically to selected measurement points and providesthickness measurements as fast as two points per second TheF50 has the same precision high-lifetime stage that performsmillions of measurements in our production systems

  • 层厚测量仪

    我们具有很好的技术积累并努力达到最高性价比  软件和算法为自主开发,可按客户需求进行定制化改进  设备硬件系统为自主生产以节省成本,最大化优化客户的投入产出比  我们与客户共同努力让机台呈现出最好的性能,并更具您的需求定制小型机或者全自动机台  我们提供及时的技术服务支持

  • 套刻及线宽检测设备

    MueTec—Overlay and CD measurement • With Vistec microscope, laser focus, automatic tool CD (Critical Dimension) VIS: Down to 0 5 um UV: Down to 0 3 um Overlay Accuracy: 3nm *IR function

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